Main applicationsFor work on laminate flooring and compound materialsMelamine resin board machiningPhenolic-resin-bonded plates (HPL, Trespa)Technical DataDiameter 260 mmCutting width 2.50 mmHole dia. 30 mmNo. of teeth 64.00Chip angle -5.00 °Standard blade thickness 1.80 mmTooth shape WZ/FA